work with BGA device it is necessary put together BGA-Top-265 ZIF with
some BGA-Bottom-X board according to the information provided by PG4UW
top cover must be fully actuated (depressed) before inserting a package
into the socket. If the chip is inserted into only partially opened ZIF
socket, then - after releasing of top - the tweezer contact might bend
and if more times done by this way also tweezer contact can be broken.
fully actuated, drop the device into the socket from a height of 2 to
3mm above the seating plane.
not push package while loading or releasing the lid.
not directly touch the pins of the adapter, because dirt may cause
errors during programming of device.
picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X
boards to have complete BGA adapter.
conditions: operating temperature 5°C ÷ 40°C
(41°F ÷ 104°F), operating humidity 20%..80%,